Specific Process Knowledge/Lithography/UVExposure: Difference between revisions
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'''THIS SECTION IS UNDER CONSTRUCTION''' [[Image:section under construction.jpg|70px]] | '''THIS SECTION IS UNDER CONSTRUCTION''' [[Image:section under construction.jpg|70px]] | ||
'''Feedback to this section''': '''[mailto:lithography@Nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_03 click here]''' | |||
MLA150 maskless aligner from Heidelberg Instruments GmbH. | |||
Special features: | |||
*Backside Alignment | |||
*Advanced Field Alignment Mode for alignment to individual chips/devices on the substrate | |||
Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=464 LabManager] | |||
===[[Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 03 processing|Process information]]=== | |||
=== Equipment performance and process related parameters === | === Equipment performance and process related parameters === | ||