Specific Process Knowledge/Lithography/UVExposure: Difference between revisions
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'''THIS SECTION IS UNDER CONSTRUCTION''' [[Image:section under construction.jpg|70px]] | '''THIS SECTION IS UNDER CONSTRUCTION''' [[Image:section under construction.jpg|70px]] | ||
=== Equipment performance and process related parameters === | |||
{| border="2" cellspacing="0" cellpadding="2" | |||
!style="background:silver; color:black;" align="center" width="60"|Purpose | |||
|style="background:LightGrey; color:black"| | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
Alignment and UV exposure | |||
|- | |||
!style="background:silver; color:black" align="left" valign="center" rowspan="6"|Performance | |||
|style="background:LightGrey; color:black"|Exposure mode | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
Projection | |||
|- | |||
| style="background:LightGrey; color:black"|Exposure light | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
*405nm (laser diode arrays) | |||
|- | |||
|style="background:LightGrey; color:black"|Focusing method | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
*Pneumatic | |||
|- | |||
|style="background:LightGrey; color:black"|Minimum structure size | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
down to 1µm | |||
|- | |||
|style="background:LightGrey; color:black"|Design formats | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
*'''GDS-II''' | |||
*CIF | |||
*DXF | |||
*Gerber | |||
*HIMT format | |||
|- | |||
|style="background:LightGrey; color:black"|Alignment modes | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
*Top side alignment | |||
*Backside alignment | |||
*Field alignment (chip-by-chip TSA) | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Substrate size | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
* maximum writing area: 150x150 mm<sup>2</sup> | |||
* 150 mm wafer | |||
* 100 mm wafer | |||
* 50 mm wafer | |||
* pieces down to 5x5 mm<sup>2</sup> | |||
|- | |||
| style="background:LightGrey; color:black"|Allowed materials | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
All cleanroom materials | |||
|- | |||
|style="background:LightGrey; color:black"|Batch | |||
|style="background:WhiteSmoke; color:black" align="center" colspan="2"| | |||
1 | |||
|- | |||
|} | |||
<br clear="all" /> | |||
==Inclined UV Lamp== | ==Inclined UV Lamp== | ||