Specific Process Knowledge/Characterization/Profiler: Difference between revisions
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==Optical Profiler (Filmetrics)== | |||
[[image:|275x275px|right|thumb|Optical Profiler (Sensofar): positioned in the basement 346-900)]] | |||
The PLu Neox 3D Optical Profiler (from Sensofar) has a dual-technology sensor head that combines confocal and interferometry techniques as well as thick and thin film measurement capabilities. | |||
The Neox sensor head provides standard microscope imaging, confocal imaging, confocal profiling, PSI (Phase Shift Interferometry), VSI (Vertical Scanning Interferometry) and high resolution thin film thickness measurements on a single instrument. | |||
The main purpose is 3D topographic imaging of surfaces, step height measurements in smaller trenches/holes than can be obtained with standard stylus methods (i.e. with aspect ratios higher that 1:1), roughness measurements with larger FOV (Field Of View) than the AFM, but less horisontal resolution. | |||
For most samples the optical profiler provides fast and easy information without any sample preparation. However, it can be necessary to cover thin transparent layers (< 2 µm) with a thin layer of metal. | |||
The resolution is limited by the objectives and the pixel resolution. Also the depth of focus is limited, especially for higher magnifications. | |||
'''The user manual, technical information and contact information can be found in LabManager:''' | |||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=301 Optical profiler (Sensofar) info page in LabManager] | |||
===Process Information=== | |||
*[[/Optical Profiler (Sensofar) acceptance test|Results from the Optical Profiler (Sensofar) acceptance test]] | |||
===Equipment performance and process related parameters=== | |||
{| border="2" cellspacing="0" cellpadding="10" | |||
!colspan="2" border="none" style="background:silver; color:black;" align="center"|<b>Equipment</b> | |||
|style="background:WhiteSmoke; color:black"|<b>Optical profiler</b> | |||
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!style="background:silver; color:black;" align="left"|Purpose | |||
|style="background:LightGrey; color:black"|3D topographic imaging of surfaces.||style="background:WhiteSmoke; color:black"| | |||
*3D imaging of surfaces | |||
*Roughness measurements | |||
*Step height measurements | |||
*3D topographic measurements | |||
*Thick and thin film thickness measurements in small spots (down to 4 µm) | |||
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!style="background:silver; color:black;" align="left"|Posibilities | |||
|style="background:LightGrey; color:black"|Confocal and interferometric profiling and reflectometry||style="background:WhiteSmoke; color:black"| | |||
*Standard microscope imaging | |||
*Confocal imaging | |||
*Confocal profiling | |||
*PSI (Phase Shift Interferometry) | |||
*VSI (Vertical Scanning Interferometry) | |||
*High resolution thin film thickness measurement using reflectrometry | |||
*Stitched scans | |||
*Wafer mapping | |||
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!style="background:silver; color:black" align="left"|Performance | |||
|style="background:LightGrey; color:black"|Depending on the objective chosen||style="background:WhiteSmoke; color:black"| | |||
*See the performance of the different objectives here: [[image:Optical_Profiler_Table_2.jpg|27x27px|center|thumb]] | |||
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!style="background:silver; color:black" align="left"|Substrates | |||
|style="background:LightGrey; color:black"|Substrate size | |||
|style="background:WhiteSmoke; color:black"| | |||
*Substrates no bigger than 150 mm x 150mm | |||
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|style="background:silver; color:black"| | |||
| style="background:LightGrey; color:black"|Substrate materials allowed | |||
|style="background:WhiteSmoke; color:black"| | |||
*In principle all materials | |||
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== Dektak 3ST == | == Dektak 3ST == | ||