Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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* Bosch processes with etch and dep cycles each split into three | * Bosch processes with etch and dep cycles each split into three | ||
* Parameter ramping during process steps | * Parameter ramping during process steps | ||
* Picoscope monitoring | |||
* SOI option to reduce notching at buried | |||
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* Bosch processes with etch and dep cycles each split into three | * Bosch processes with etch and dep cycles each split into three | ||
* Parameter ramping during process steps | * Parameter ramping during process steps | ||
* Verity OES | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="4"|Substrates | ||
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* Load lock | * Load lock | ||
* MACS | * MACS (Multiplex Atmospheric Cassette System) | ||
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* Load lock | * Load lock | ||