Specific Process Knowledge/Thin film deposition/MVD: Difference between revisions
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'''Feedback to this page''': '''[mailto:photolith@ | '''Feedback to this page''': '''[mailto:photolith@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/MVD click here]''' | ||
[[Category: Equipment|Thin film MVD]] | [[Category: Equipment|Thin film MVD]] | ||
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[[image:Mvd.jpg|200x200px|right|thumb|The MVD is located in cleanroom A-1]] | [[image:Mvd.jpg|200x200px|right|thumb|The MVD is located in cleanroom A-1]] | ||
The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. At | The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. At DTU Nanolab the MVD is an essential tool for nanoimprint lithography, where it is used to create antistiction coatings on the imprint stamps. | ||
'''The user manual, user APV, and contact information can be found in LabManager:''' | '''The user manual, user APV, and contact information can be found in LabManager:''' | ||
[http://labmanager | [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=199 MVD in LabManager] | ||
==Process information== | ==Process information== |
Revision as of 16:11, 25 November 2019
Feedback to this page: click here
The Molecular Vapor Deposition tool
The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. At DTU Nanolab the MVD is an essential tool for nanoimprint lithography, where it is used to create antistiction coatings on the imprint stamps.
The user manual, user APV, and contact information can be found in LabManager:
Process information
Purpose |
| ||
---|---|---|---|
Vapor sources | Line
|
Chemical
| |
Performance | Contact angle |
110° (water) | |
Process parameters | Base pressure |
20 mTorr | |
Chamber temperature |
35°C | ||
Chamber volume |
Approx. 3 liters | ||
Substrates | Substrate size |
1" to 8" Smaller samples may be processed if fixed to a carrier | |
Allowed materials |
All cleanroom materials except steel and other ferrous materials | ||
Batch |
One sample at a time Two 4" or 6" wafers may be processed simultaneously using cassettes |