Specific Process Knowledge/Etch/Wet Aluminium Etch: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@ | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Aluminium_Etch click here]''' | ||
[[Category: Equipment|Etch Wet Aluminium Etch]] | [[Category: Equipment|Etch Wet Aluminium Etch]] | ||
[[Category: Etch (Wet) bath|Aluminium]] | [[Category: Etch (Wet) bath|Aluminium]] | ||
Wet | Wet ethcing of aluminium can be done using many different acids and bases. Using dilute phosphoric acid gives reasonably good control and compatibility with photoresists. Etching with dilute phosphoric acid is suitable for etching pure aluminium. If the aluminium is alloyed with other metals, other etchants may be better suited. Previously, aluminium with 1,5% silicon was used at DTU Danchip. This alloy is no longer in use at DTU Danchip but a suitable etchant (PES 77-19-04) for this alloy is included below. | ||
=Wet Aluminium Etch= | =Wet Aluminium Etch= | ||