Specific Process Knowledge/Etch/Etching of Silicon Oxide: Difference between revisions
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![[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP metal]] | ![[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP metal]] | ||
![[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] | ![[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] | ||
![[Specific Process Knowledge/Etch/HF Vapour Phase Etch|HF Vapour Phase Etch]] | |||
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*Primarily for pure physical etch by sputtering with Ar-ions | *Primarily for pure physical etch by sputtering with Ar-ions | ||
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*This is a fact about HF VPE | |||
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*Any material that is accepted in the machine | *Any material that is accepted in the machine | ||
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*HF VPE mask material 1 | |||
*HF VPE mask material 2 | |||
*HF VPE mask material 3 | |||
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*Process dependent | *Process dependent | ||
*Tested once ~22nm/min | *Tested once ~22nm/min | ||
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*Sample and load dependent | |||
*Expected range: 12 - 175 nm/min | |||
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*<nowiki>#</nowiki>1 150 mm wafers with special carrier | *<nowiki>#</nowiki>1 150 mm wafers with special carrier | ||
*<nowiki>#</nowiki>1 200 mm wafer | *<nowiki>#</nowiki>1 200 mm wafer | ||
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*Pieces | |||
*<nowiki>#</nowiki>1 50 mm wafer | |||
*<nowiki>#</nowiki>1 100 mm wafer | |||
*<nowiki>#</nowiki>1 150 mm wafer | |||
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*Polymers | *Polymers | ||
*Capton tape | *Capton tape | ||
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*[http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=458 Please take a look in the cross contamination sheet in LabManager for details] | |||
*Silicon | |||
*Silicon oxides | |||
*Aluminium | |||
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Revision as of 12:32, 20 September 2019
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Comparing silicon oxide etch methods at DTU Nanolab
There are a broad varity of silicon oxide etch methods at DTU Nanolab. The methodes are compared here to make it easier for you to compare and choose the one that suits your needs.
- Wet Silicon Oxide Etch
- SiO2 etch using ASE
- SiO2 etch using III-V RIE
- SiO2 etch using AOE
- SiO2 etch using ICP metal
- IBE/IBSD Ionfab 300
- SiO2 etch using Plasma Asher (isotropic)
Compare the methods for Silicon Oxide etching
Wet Silicon Oxide etch (BHF/HF) | ASE | III-V RIE | AOE (Advanced Oxide Etch) | ICP metal | IBE/IBSD Ionfab 300 | HF Vapour Phase Etch | |
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Generel description |
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Possible masking materials |
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Etch rate range |
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Substrate size |
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Allowed materials |
In the dedicated bath:
In a plastic beaker:
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