Specific Process Knowledge/Thermal Process/C4 Aluminium Anneal furnace: Difference between revisions
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*Silicon wafers with aluminium. | *Silicon wafers with aluminium. | ||
*Silicon wafers with | *Silicon wafers with Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub> deposited by ALD | ||
*Wafers are allowed enter the furnace after aluminium lift-off or after aluminium etch and resist strip in acetone | *Wafers are allowed enter the furnace after aluminium lift-off or after aluminium etch and resist strip in acetone | ||
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