Specific Process Knowledge/Thin film deposition/Furnace LPCVD TEOS: Difference between revisions
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**from furnaces in stack A or B in cleanroom 2 | **from furnaces in stack A or B in cleanroom 2 | ||
*Quartz wafers (RCA cleaned) | *Quartz wafers (RCA cleaned) | ||
*Silicon carbide sample(RCA cleaned) | |||
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