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Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6_-_2|Aligner: MA6 - 2]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6_-_2|Aligner: MA6 - 2]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner-6inch|Aligner: 6inch]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Inclined UV Lamp|Inclined UV Lamp]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Inclined UV Lamp|Inclined UV Lamp]]</b>
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*(DUV exposure)
*(DUV exposure)
*Bond alignment
*Bond alignment
|style="background:WhiteSmoke; color:black"|
*Top Side Alignment
*Back Side Alignment
*UV exposure
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Top Side Alignment
*Top Side Alignment
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1.5µm down to 0.5µm
*1.5µm down to 0.5µm
|style="background:WhiteSmoke; color:black"|
*1.5µm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*2µm down to 1µm
*2µm down to 1µm
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*UV350 optics optional
*UV350 optics optional
*UV250 optics optional
*UV250 optics optional
|style="background:WhiteSmoke; color:black"|
*350W Hg lamp
*SU8 filter (long-pass), intensity in Constant Power mode: 7mW/cm<sup>2</sup> @ 365nm
*i-line filter optional
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*365nm LED
*365nm LED
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*proximity, soft, hard, vacuum contact
*proximity, soft, hard, vacuum contact
|style="background:WhiteSmoke; color:black"|
*proximity, soft, hard, vacuum contact
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*proximity, soft, hard, vacuum contact  
*proximity, soft, hard, vacuum contact  
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*1 100 mm wafer
*1 100 mm wafer
*1 150 mm wafer
*1 150 mm wafer
|style="background:WhiteSmoke; color:black"|
*1 50 mm wafers
*1 100 mm wafers
*1-25 150 mm wafers with automatic handling
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 small sample, down to 5x5 mm<sup>2</sup>
*1 small sample, down to 5x5 mm<sup>2</sup>
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*All cleanroom materials except copper and steel
*All cleanroom materials except copper and steel
*Dedicated chuck for III-V materials
*Dedicated chuck for III-V materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except III-V materials, copper and steel substrates, and type IV films
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials
*All cleanroom materials
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