Specific Process Knowledge/Lithography/Development: Difference between revisions
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'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual click here]''' | '''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual click here]''' | ||
Developer: E-beam Manual is a manually operated, single substrate or chip spray-puddle developer. It uses the N50 or AR 600-546 developers and | Developer: E-beam Manual is a manually operated, single substrate or chip spray-puddle developer. It uses the N50 or AR 600-546 developers and IPA for rinsing. The substrates or chips are loaded manually one by one into the developer. Developer dispense, puddle time, water rinse, and drying is performed automatically by the equipment. | ||
The machine is setup to agitate and be stationary to enhance the development uniformity - this is a ongoing process. | The machine is setup to agitate and be stationary to enhance the development uniformity - this is a ongoing process. | ||