Specific Process Knowledge/Lithography/Development: Difference between revisions

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+==Developer: E-beam Manual==
+[[Image:IMG 2464.JPG|300×300px|right|thumb|Developer: TMAH Manual is located in E-4]]
+'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual click here]'''
+Developer: E-beam Manual is a manually operated, single substrate or chip spray-puddle developer. It uses the N50 or AR 600-546 developers and IPAA for rinsing. The substrates or chips are loaded manually one by one into the developer. Developer dispense, puddle time, water rinse, and drying is performed automatically by the equipment.
+The machine is setup to agitate and be stationary to enhance the development uniformity - this is a ongoing process.
+'''[http://podcast.llab.dtu.dk/fileadmin/podcasts/2016/DTUDanchip/1.049_Developer_Manual-720p.mp4 Training video]'''
+'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 LabManager]'''
+===Process information===
+'''Process recipes'''
+*DP 2x60s: Double puddle, 2 times 60s. Rinse and dry.
+*MP 4x60s: Multiple puddle, 4 times 60s. Rinse and dry.
+*SP 120s: Single puddle, 120s. Rinse and dry.
+*SP 15s: Single puddle, 15s. Rinse and dry.
+*SP 30s: Single puddle, 30s. Rinse and dry.
+*SP 60s: Single puddle, 60s. Rinse and dry.
+'''Utility recipes'''
+*UTIL-DR: Dome rinse.
+*UTIL-BE: Bottle empty. Danchip use only.
+=== Equipment performance and process related parameters ===
+{| border="2" cellspacing="0" cellpadding="2"
+!style="background:silver; color:black;" align="center" width="60"|Purpose
+|style="background:LightGrey; color:black"|
+|style="background:WhiteSmoke; color:black"|
+Development of
+*AZ nLOF
+*AZ MiR 701
+*AZ 5214E
+*AZ 4562
+*DUV resists
+|-
+!style="background:silver; color:black;" align="center" width="60"|Developer
+|style="background:LightGrey; color:black"|
+|style="background:WhiteSmoke; color:black" align="center"|
+AZ 726 MIF
+(2.38% TMAH in water)
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Method
+|style="background:LightGrey; color:black"|Development
+|style="background:WhiteSmoke; color:black" align="center"|
+Spray/Puddle
+|-
+|style="background:LightGrey; color:black"|Handling
+|style="background:WhiteSmoke; color:black" align="center"|
+Edge handling chuck or chip "basket"
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
+|style="background:LightGrey; color:black"|Temperature
+|style="background:WhiteSmoke; color:black" align="center"|
+Room temperature
+|-
+|style="background:LightGrey; color:black"|Agitation
+|style="background:WhiteSmoke; color:black" align="center"|
+none
+|-
+|style="background:LightGrey; color:black"|Rinse
+|style="background:WhiteSmoke; color:black" align="center"|
+DI water
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
+|style="background:LightGrey; color:black"|Substrate size
+|style="background:WhiteSmoke; color:black" align="center"|
+* Chips (6-60 mm)
+* 100 mm wafers
+* 150 mm wafers
+|-
+| style="background:LightGrey; color:black"|Allowed materials
+|style="background:WhiteSmoke; color:black" align="center"|
+All cleanroom approved materials
+Film or pattern of all types
+|-
+|style="background:LightGrey; color:black"|Batch
+|style="background:WhiteSmoke; color:black" align="center"|
+|-
+|}
+<br clear="all" />
 ==Developer: TMAH Manual==