Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/polySi/Cpoly2: Difference between revisions
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Revision as of 11:36, 11 February 2019
| Date | Substrate Information | Process Information | SEM Images | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
| 3/12-2014 | 1/4 6" Wafer with 210 nm oxide and 1800 nm polysilicon CB on oxide carrier | standard stepper mask (50 nm barc + 320 nm krf) | Si / 50+ % | Pegasus/jmli | 10 minute TDESC clean + 45 sec barc etch | danchip/jml/showerhead/Cpoly2, 20 cycles or 2:08 minutes | S004729 | New showerhead | |
