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Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions

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|style="background:LightGrey; color:black"|Thickness uniformity
|style="background:LightGrey; color:black"|Thickness uniformity
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*<5 % variation across a 4" wafer with 100 nm Al
*approx. 12 % change from center to edge on a 4" wafer with 100 nm Al
*<10 % variation across a 4" wafer with 100 nm Ag
*approx. 20 % change from center to edge on a 4" wafer with 100 nm Ag
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|style="background:LightGrey; color:black"|Pumpdown time
|style="background:LightGrey; color:black"|Pumpdown time
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