Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions
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*Thermal evaporation of metals | *Thermal evaporation of metals | ||
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!style="background:silver; color:black" align="left" valign="top" rowspan=" | !style="background:silver; color:black" align="left" valign="top" rowspan="4"|Performance | ||
|style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"| | |style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"| | ||
*10Å - 1µm* | *10Å - 1µm* | ||
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*In general, 0.5-10 Å/s is possible | *In general, 0.5-10 Å/s is possible | ||
*We need to develop a new process for each rate | *We need to develop a new process for each rate | ||
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|style="background:LightGrey; color:black"|Thickness uniformity | |||
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*<5 % variation across a 4" wafer with 100 nm Al | |||
*<10 % variation across a 4" wafer with 100 nm Ag | |||
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|style="background:LightGrey; color:black"|Pumpdown time | |||
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*10-15 min to <1x10<sup>-5</sup> Torr | |||
*20-30 min to <3x10<sup>-6</sup> Torr | |||
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!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range | !style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range | ||
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'''*''' ''For thicknesses above | '''*''' ''For thicknesses above 600 nm, please request permission.'' | ||