Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10: Difference between revisions

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== The nano1.0 recipe ==
== The nano1.0 recipe ==

Revision as of 12:41, 30 July 2018

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The nano1.0 recipe

Recipe nano1.0
Recipe Gas C4F8 38 sccm, SF6 52 sccm
Pressure 4 mTorr, Strike 3 secs @ 15 mTorr
Power 800 W CP, 50 W PP
Temperature 10 degs
Hardware 100 mm Spacers
Time 120 secs
Conditions Run ID 1801
Conditioning Sequence: Oxygen clean, MU tests, processes, no oxygen between runs
Mask 1dfhj10 nm zep etched down to 6dgh4 nm



Nominal trench line width ' 30 60 90 120 150 Avg Std
Etch rates nm/min 239 281 306 320 328 295 36
Sidewall angle degs 93 94 93 92 93 93 1
CD loss nm/edge -1 -5 -11 -9 -32 -11 12
CD loss foot nm/edge -1 -5 -11 -9 -2 -5 5
Bowing 41 33 29 30 22 31 7
Curvature -51 -50 -43 -39 -42 -45 5
zep nm/min 46

Comments

The process looks to be too etch aggressive, not enough passivation. Consider any or all of the following:

  • Decreasing the wafer temperature (make more passivant)
  • Increasing C4F8 flow (make more passivant)
  • Increasing platen power (make more directional)
  • Decreasing coil power (make less etch-aggressive and more directional.

Also, if the tool has Short Funnel and 5mm spacers fitted, it may be too close to the plasma - previous good nano-scale etch result was achieved with Long Funnel and 100mm spacers.

The conditions are similar to the nano-etch conditions for acceptance process C:

Etch
Gas Flow (sccm) SF6 38 + C4F8 70
Pressure (mT) 4
APC angle (%) 33.2
Coil power (W) 450
Matching (Forward/ Load) L/ 33 & T/ 43
HF Platen power (W) 100
Matching (Forward/ Load) L/ 49 & T/ 53
Time 01:30
Hardware configuration 150mm Long funnel, with baffle & 100mm spacers
APC Gain 7.5 (default)
Platen Temperature 10°C

The highlighted sections are the main differences between the Process C conditions Vs new Imprint Trenches conditions: all of the changes would push the process to be more passivant, less etch aggressive and more directional.

Is there any reason why these conditions are not suitable for the Imprint Trenches etch?