Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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= General Pegasus information = | |||
==Wafer bonding== | |||
To find information on how to bond wafers or chips to a carrier wafer, click [[Specific Process Knowledge/Etch/DryEtchProcessing/Bonding| '''HERE''']]. | To find information on how to bond wafers or chips to a carrier wafer, click [[Specific Process Knowledge/Etch/DryEtchProcessing/Bonding| '''HERE''']]. | ||
==Characterisation of etched trenches== | |||
Comparing differences in etched trenches requires a set of common parameters for each trench. Click [[Specific Process Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisation|'''HERE''']] to find more information about the parameters used on the DRIE-Pegasus process development. | Comparing differences in etched trenches requires a set of common parameters for each trench. Click [[Specific Process Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisation|'''HERE''']] to find more information about the parameters used on the DRIE-Pegasus process development. | ||
==Material from SPTS== | |||
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/SPTSdocs|Hardware and process applications]] | *[[Specific Process Knowledge/Etch/DRIE-Pegasus/SPTSdocs|Hardware and process applications]] | ||
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ|Miscellaneous information]] | *[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ|Miscellaneous information]] | ||