Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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In 2010 Danchip acquired DRIE-Pegasus 1 (at the time called DRIE-Pegasus). As a state-of-the-art etch tool with excellent performance and great flexibility, it grew immensely popular and by 2015 it was apparent that we needed yet another tool to cope with the demand. Therefore, in 2016 Pegasus 2 was acquired from a closed-down lab in Morocco and installed next to Pegasus 1. | In 2010 Danchip acquired DRIE-Pegasus 1 (at the time called DRIE-Pegasus). As a state-of-the-art etch tool with excellent performance and great flexibility, it grew immensely popular and by 2015 it was apparent that we needed yet another tool to cope with the demand. Therefore, in 2016 Pegasus 2 was acquired from a closed-down lab in Morocco and installed next to Pegasus 1. | ||
Looking to expand our dry etching capabilities in 2017 we got an irresistible offer on a twin Pegasus system with cassette to cassette vacuum robot from a commerciel fab. The twin Pegasus system (will be called Pegasus 3 and 4) will be installed at the old cluster 2 location in cleanroom C1 from August 2018 onwards. | Looking to expand our dry etching capabilities in 2017 we got an irresistible offer on a twin Pegasus system with cassette to cassette vacuum robot from a commerciel fab. The twin Pegasus system (will be called Pegasus 3 and 4) will be installed at the old cluster 2 location in cleanroom C1 from August 2018 onwards. We intend to use one chamber as 6" silicon etch work horse and the other to be converted into a dielectric etch tool that will supplement/replace the AOE. | ||
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