Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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| style="background:Whitesmoke; color:black"|Allowed materials | | style="background:Whitesmoke; color:black"|Allowed materials | ||
|style="background:Whitesmoke; color:black"| | |||
* Silicon wafers | |||
* Quartz wafers need a (semi)conducting layer for clamping | |||
|style="background:Whitesmoke; color:black"| | |||
* Silicon wafers | |||
* Quartz wafers need a (semi)conducting layer for clamping | |||
|style="background:Whitesmoke; color:black"| | |||
* Silicon wafers | |||
* Quartz wafers need a (semi)conducting layer for clamping | |||
|style="background:Whitesmoke; color:black"| | |style="background:Whitesmoke; color:black"| | ||
* Silicon wafers | * Silicon wafers | ||
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* DUV stepper resist (barc + krf) | * DUV stepper resist (barc + krf) | ||
* Oxides and nitrides | * Oxides and nitrides | ||
* Aluminium (only very | * Aluminium (only very gentle processes such as process C and nanoetches) | ||
|style="background:LightGrey; color:black"| | |||
* AZ photoresist | |||
* zep resist | |||
* DUV stepper resist (barc + krf) | |||
* Oxides and nitrides | |||
* Aluminium (only very gentle processes) | |||
|style="background:LightGrey; color:black"| | |||
* AZ and MiR photoresist | |||
* zep resist | |||
* DUV stepper resist (barc + krf) | |||
* Oxides and nitrides | |||
|style="background:LightGrey; color:black"| | |||
* AZ photoresist | |||
* zep resist | |||
* DUV stepper resist (barc + krf) | |||
* Oxides and nitrides | |||
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