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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:silver; color:black" width="300" |[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-1| '''DRIE-Pegasus 1''']]
|style="background:silver; color:black" width="250" |[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-1| '''DRIE-Pegasus 1''']]
|style="background:silver; color:black"|[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2| '''DRIE-Pegasus 2''']]
|style="background:silver; color:black" width="250" |[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2| '''DRIE-Pegasus 2''']]
|style="background:silver; color:black"|[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3| '''DRIE-Pegasus 3''']]
|style="background:silver; color:black" width="250" |[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3| '''DRIE-Pegasus 3''']]
|style="background:silver; color:black"|[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4| '''DRIE-Pegasus 4''']]
|style="background:silver; color:black" width="250" |[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4| '''DRIE-Pegasus 4''']]
|-
|-
!style="background:silver; color:black;" align="center" valign="center" width="80" rowspan="2"|Purpose  
!style="background:silver; color:black;" align="center" valign="center" width="80" rowspan="2"|Purpose  
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|style="background:LightGrey; color:black"|Process options
|style="background:LightGrey; color:black"|Process options
|style="background:lightgrey; color:black"|
|style="background:lightgrey; color:black"|
* Bosch processes with etch and dep cycles possibly split into three individually controllable parts
* Bosch processes with etch and dep cycles each split into three
* Parameter ramping during process steps
* Parameter ramping during process steps
* SOI option to reduce notching at buried  
* SOI option to reduce notching at buried  
* Picoscope monitoring
* Claritas endpoint detection system
|style="background:lightgrey; color:black"|
* Bosch processes with etch and dep cycles each split into three
* Parameter ramping during process steps
* SOI option to reduce notching at buried
* Picoscope monitoring
* Verity OES
|style="background:lightgrey; color:black"|
* Bosch processes with etch and dep cycles each split into three
* Parameter ramping during process steps
|style="background:lightgrey; color:black"|
* Bosch processes with etch and dep cycles each split into three
* Parameter ramping during process steps
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:whitesmoke; color:black"|Batch size
|style="background:whitesmoke; color:black"|Batch size
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/DRIE-Pegasus"