Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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|style="background:WhiteSmoke; color:black"|<b>DRIE-Pegasus</b> | |style="background:WhiteSmoke; color:black"|<b>DRIE-Pegasus</b> | ||
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!style="background:silver; color:black;" align="center" width="80"|Purpose | !style="background:silver; color:black;" align="center" valign="center" width="80" rowspan="2"|Purpose | ||
|style="background:LightGrey; color:black"| Dry etch of | |style="background:LightGrey; color:black"| Dry etch of | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* Silicon | * Silicon | ||
* Barc | * Barc | ||
|- | |||
|style="background:LightGrey; color:black"|Alternative | |||
|style="background:WhiteSmoke; color:black"| | |||
* Black silicon | |||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | ||
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* Aluminium (only very mild processes such as process C and nanoetches) | * Aluminium (only very mild processes such as process C and nanoetches) | ||
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== General Pegasus information == | == General Pegasus information == | ||