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| *[[Specific Process Knowledge/Etch/DRIE-Pegasus/Claritas|Addition of a Claritas optical endpoint system in June 2018]] | | *[[Specific Process Knowledge/Etch/DRIE-Pegasus/Claritas|Addition of a Claritas optical endpoint system in June 2018]] |
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| '''Other etch processes'''
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| *[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch|Nanostructure etches including nano1.42]]
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| *[[Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch|Etch processes with DUV masks]]
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| *[[Specific Process Knowledge/Etch/DRIE-Pegasus/Barc|BARC etches]]
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| *[[Specific Process Knowledge/Etch/DRIE-Pegasus/Isotropic|Isotropic etches]]
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| More processes, such as for DUV resist, are currently being developed, but they are not quite 'ready for publication' at LabAdviser so please contact Jonas (mailto:jml@danchip.dtu.dk) for more information.
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| <!-- *[[Specific Process Knowledge/Etch/DRIE-Pegasus/slopedsidewalls|Etches that produce positively sloped sidewalls for imprinting purposes]] -->
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| <!-- *[[Specific Process Knowledge/Etch/DRIE-Pegasus/Waferthinning| Maskless reduction of wafer thicknesses]] -->
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| <!-- *[[Specific Process Knowledge/Etch/DRIE-Pegasus/VeeryDeeep| Very deep etching]] -->
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| '''Advanced Processing - Henri Jansen style'''
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| * [[/Etch high aspect ratio silicon microstructures|Etch high aspect ratio silicon microstructures ]]
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| * [[/Etch 3 dimensional silicon microstructures|Etch 3 dimensional silicon microstructures]]
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| * [[/Etch black silicon|Etch black silicon]]
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| * [[/Using OES to monitor etch process|Using OES to monitor etch process]]
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| '''Wafer bonding''' | | '''Wafer bonding''' |
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| To find information on how to bond wafers or chips to a carrier wafer, click [[Specific Process Knowledge/Etch/DryEtchProcessing/Bonding| here]]. | | To find information on how to bond wafers or chips to a carrier wafer, click [[Specific Process Knowledge/Etch/DryEtchProcessing/Bonding| here]]. |
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| '''Acceptance test'''
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| The instrument was opened for users in April 2010 when the acceptance test was signed. This was based on the performance of five standard recipes (A, B, C, D and SOI) that are further examined below. The acceptance test report is found [[Media:Pegasus_AcceptanceTest.pdf|here]].
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| '''Characterisation of etched trenches''' | | '''Characterisation of etched trenches''' |
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| *[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ|Miscellaneous information]] | | *[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ|Miscellaneous information]] |
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| '''Internal Danchip Process log'''
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| Process log at Danchip [http://labintra.danchip.dtu.dk/index.php/Main_Page/Process_Logs/jmli/Pegasus]
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| ==Equipment performance and process related parameters== | | ==Equipment performance and process related parameters== |
