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Specific Process Knowledge/Etch/KOH Etch: Difference between revisions

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<sup>{{fn|1}}</sup> Measured by Eric Jensen from DTU-Nanotech, October 2013.
<sup>{{fn|1}}</sup> Measured by Eric Jensen from DTU-Nanotech, October 2013.
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===Etch rates: Empirical formula (Seidl et al)===
The following empirical formula can be used for concentrations in the range of 10-60 wt%:
R = k<sub>0</sub> [H<sub>2</sub>O]<sup>4</sup> [KOH]<sup>0.25</sup> e<sup>-E<sub>a</sub>/kT</sup>,
where k<sub>0</sub> = 2480 µm/hr (mol/l)<sup>-4.25</sup>, E<sub>a</sub> = 0.595 eV for Si(100)
and  k<sub>0</sub> = 4500 µm/hr (mol/l)<sup>-4.25</sup>, E<sub>a</sub> = 0.60 eV for Si(110)