Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions
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[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold#Studies_of_Au_deposition_processes_in_the_Wordentec| Temperature and roughness studies of Au deposition processes in the Wordentec] | [http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold#Studies_of_Au_deposition_processes_in_the_Wordentec| Temperature and roughness studies of Au deposition processes in the Wordentec] | ||
While E-beam evaporation, some materials like Au and Al can affect the underlying layers, especially thin resists like E-beam sensitive can get exposed or even change the topography when creating thin films. Cases of releasing bubbles of the solvent will create a crater like surface on some materials. In most cases this is only affecting the areas containing resist, hence liftoff is often easier and the areas without resist will have good adhesion. | While E-beam evaporation, some materials like Au and Al can affect the underlying layers, especially thin resists like E-beam sensitive can get exposed or even change the topography when creating thin films. Cases of releasing bubbles of the solvent will create a crater like surface on some materials. In most cases this is only affecting the areas containing resist, hence liftoff is often easier and the areas without resist will have good adhesion. | ||
[[Media:WaferAfterWordentec.ogg|Au peeling of after wordentech on thin E-beam resist]] | [[Media:WaferAfterWordentec.ogg|Au peeling of after wordentech on thin E-beam resist]] | ||