Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions

Revision as of 16:13, 19 February 2018 view source Lgpe (talk \| contribs) DCH-Employees-701, NLAB-Employees-701 353 edits →The metals available for E-beam evaporation and their standard deposition rates are: ← Older edit		Revision as of 16:19, 19 February 2018 view source Lgpe (talk \| contribs) DCH-Employees-701, NLAB-Employees-701 353 edits →The metals available for E-beam evaporation and their standard deposition rates are: Newer edit →
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	[[Media:WaferAfterWordentec.ogg]]		[Media:WaferAfterWordentec.ogg\|Au peeling of after wordentech on thin E-beam resist]

	===Thermal evaporation materials===		===Thermal evaporation materials===