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Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, danchip
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Choi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, danchip
641 edits
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|style="background:LightGrey; color:black"|Uniformity
|style="background:LightGrey; color:black"|Uniformity
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
Around 5-10% (depending on sample and process)
Around 2-10% (depending on sample and process)
   
   
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