Specific Process Knowledge/Etch/Wet Gold Etch: Difference between revisions

Revision as of 11:43, 27 February 2017 view source Choi (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, danchip 641 edits →Etching of Gold ← Older edit		Revision as of 14:55, 23 January 2018 view source Choi (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, danchip 641 edits →Etching of Gold Newer edit →
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	# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at Danchip. Can be used with AZ resist as mask.		# Iodine etch: KI:I<sub>2</sub>:H<sub>2</sub>O - 100g:25g:500ml - standard at Danchip. Can be used with AZ resist as mask.
	# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid which will etch most metals and ~~are~~ therefore used when you wish to remove all the gold from your wafer. '''You must be very careful when working with Aqua Regia (Kongevand). It can generate ~~nitrous~~ oxide gases which are very toxic!!'''		# Aqua Regia (Kongevand): HNO<sub>3</sub>:HCl - 1:3 - A very strong acid which will etch most metals and is therefore used when you wish to remove all the gold from your wafer. '''You must be very careful when working with Aqua Regia (Kongevand). It can generate nitrogen oxide gases which are very toxic!!'''