Specific Process Knowledge/Characterization/Probe station: Difference between revisions
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==Probe station== | ==Probe station== | ||
[[Image:probe2.jpg|thumb|300x300px|Probe station. Positioned in serviceroom CX1]] | [[Image:probe2.jpg|thumb|300x300px|Probe station. Positioned in serviceroom CX1]] | ||
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Probe_Station click here]''' | |||
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | ||