Specific Process Knowledge/Characterization/Probe station: Difference between revisions
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==Thickness measurer== | ==Thickness measurer== | ||
[[Image: | [[Image:probe_station2.jpg|thumb|300x300px|Thickness Measurer. Positioned in serviceroom CX1]] | ||
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | ||
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching. | During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching. | ||
==Quality Control - Recipe Parameters and Limits== | ==Quality Control - Recipe Parameters and Limits== | ||
Revision as of 11:59, 21 September 2017
Probe Station
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Thickness measurer
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
Quality Control - Recipe Parameters and Limits
| Quality Control (QC) for the Thickness measurer |
|
The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year. |
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Purpose |
Thickness measurer |
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|---|---|---|
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Performance |
Thickness resolution |
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Substrates |
Batch size |
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| Substrate materials allowed |
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The Probe station is a - EPS150Triax - Cascade for I/V measurement, ohmic measurements etc, it has 4 individually adjustable probes, but can be fitted with more. It has several source meters, multi meters and a computer attached.
It can be used from pieces up to 6" wafers
The user manual, technical information and contact information can be found in LabManager: