Specific Process Knowledge/Characterization/Probe station: Difference between revisions
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==Thickness measurer== | ==Thickness measurer== | ||
[[Image: | [[Image:probe_station2.jpg|thumb|300x300px|Thickness Measurer. Positioned in serviceroom CX1]] | ||
The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas. | ||
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching. | During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching. | ||
==Quality Control - Recipe Parameters and Limits== | ==Quality Control - Recipe Parameters and Limits== | ||