Specific Process Knowledge/Thermal Process/C1 Furnace Anneal-oxide: Difference between revisions
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*Silicon wafers with layers of silicon oxide or silicon (oxy)nitride (RCA cleaned) | *Silicon wafers with layers of silicon oxide or silicon (oxy)nitride (RCA cleaned) | ||
*Wafers from the LPCVD furnaces | *Wafers from the LPCVD furnaces | ||
*Wafers from | *Wafers from PECVD4 | ||
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