Specific Process Knowledge/Thermal Process/Resist Pyrolysis Furnace: Difference between revisions

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 !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
-|style="background:WhiteSmoke; color:black"|<b>ATV</b>
+|style="background:WhiteSmoke; color:black"|<b>Reist Pyrolysis Furnace</b>
 |-
 !style="background:silver; color:black;" align="center"|Purpose
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 |style="background:LightGrey; color:black"|Process gasses
 |style="background:WhiteSmoke; color:black"|
-*N2
+*N<sub>2</sub>
-*H2
+*H<sub>2</sub>
-*O2
+*O<sub>2</sub>
 |-
 |style="background:LightGrey; color:black"|Vacuum
 |style="background:WhiteSmoke; color:black"|
-*Yes, but using N2 and O2 process gasses
+*Yes, but using N<sub>2</sub> and O<sub>2</sub> process gasses
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 |style="background:LightGrey; color:black"|Nitrogen flows
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 |style="background:LightGrey; color:black"|Batch size
 |style="background:WhiteSmoke; color:black"|
-*One-25 50 mm wafers (placed on a Si support wafers)
+*1-25 50 mm wafers (placed on a Si support wafers)
-*One-25 100 mm wafers
+*1-25 100 mm wafers
-*On2-25 150 mm  wafers
+*1-25 150 mm  wafers
 *Several smaller samples if these are placed on a support wafer
 |-