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Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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'''Feedback to this section''': '''[mailto:lithography@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_01 click here]'''
'''Feedback to this section''': '''[mailto:lithography@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_01 click here]'''


The K&W MA1006 mask aligner located in the III-V cleanroom is dedicated for processing of III-V compound semiconductors.
The MLA 100 Maskless Aligner located in the E-5 cleanroom is direct write lithography tool.  
 
It is UV exposure system, that exposes the patterns directly on photosensitive resists on chips, 2, 4, and 6 inch substrates, without prior fabrication of the mask.
Specific use of the mask aligner can be found in the standard resist recipes.
The system offers an alignment option with high accuracy.


[[Image:IMG_3078.jpg|300x300px|thumb|III-V Aligner positioned in A-5]]
[[Image:IMG_3078.jpg|300x300px|thumb|III-V Aligner positioned in A-5]]