Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

@@ Line 401: / Line 401: @@
 |style="background:LightGrey; color:black"|Exposure mode
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-soft contact, hard contact, proximity, flood exposure
+Direct writing
 |-
 | style="background:LightGrey; color:black"|Exposure light/filters
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-nm, 405 nm
+nm (LED)
 |-
 |style="background:LightGrey; color:black"|Minimum structure size
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-down to 2µm
+down to 3µm
 |-
-|style="background:LightGrey; color:black"|Mask size
+|style="background:LightGrey; color:black"|Design formats
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-*3x3inch
+*'''GDSII'''
-*5x5inch (with adapter)
+*DXF
+*CIF
+*Gerber
+*HIMT format
 |-
 |style="background:LightGrey; color:black"|Alignment modes
@@ Line 424: / Line 427: @@
 |style="background:LightGrey; color:black"|Substrate size
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-* 50 mm wafers
+* 150 mm wafer
-* small pieces 1x1cm
+* 100 mm wafer
+* 50 mm wafer
+* pieces down to 5x5 mm2
 |-
 | style="background:LightGrey; color:black"|Allowed materials
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-III-V materials
+Silicon and glass
 |-
 |style="background:LightGrey; color:black"|Batch