Specific Process Knowledge/Thin film deposition

3rd Level - Material/Method

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Choose material to deposit

Dielectrica	Semicondutors	Metals	Alloys	Transparent conductive oxides	Polymers
Silicon Nitride - and oxynitride Silicon Oxide Titania (TiO2, Titanium Oxide) Alumina (Al2O3, Aluminium Oxide) Aluminum Nitride (AlxNy) Tantalum (Ta2O5, Tantalum pentoxide) Cromia (Cr2O3, Chromium Oxide)	Silicon Germanium Zinc Oxide (ZnO)	Aluminium Titanium Chromium Cobalt Nickel Copper Molybdenum Palladium Silver Tin Tantalum Tungsten Platinum Gold Iron Magnesium Niobium Ruthenium	TiW alloy (10%/90% by weight) NiV alloy AlCu CoFe CuTi FeMn MnIr NiCo NiFe YSZ (Yttrium stabilized Zirconium)	ITO (Tin doped Indium Oxide) AZO (Aluminum doped Zinc Oxide)	SU-8 Antistiction coating Topas PMMA

Choose deposition equipment

PVD	LPCVD	PECVD	ALD	Coaters	Others
Alcatel - E-beam evaporator and sputter tool Lesker - Sputter tool PVD co-sputter/evaporation - (Decommissioned) E-beam evaporator and multiple wafer tool Wordentec - E-beam evaporator, sputter and thermal evaporator Physimeca - E-beam evaporator (III-V lab) IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching Sputter coater 03 - Gold sputtering system Sputter coater 04 - Gold sputtering system III-V Dielectric evaporator - E-beam evaporation tool	Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride Furnace LPCVD Polysilicon (4" and 6") Deposition of polysilicon Furnace LPCVD TEOS (4") - Deposition of silicon oxide	PECVD - Plasma Enhanced Chemical Vapor deposition Black Magic PECVD - Black Magic PECVD (Carbon)	ALD Picosun R200 - Atomic Layer Deposition ALD2 (PEALD) - Plasma Enhance Atomic Layer Deposition	See the Lithography/Coaters page for coating polymers	MVD - Molecular Vapor Deposition Electroplating-Ni - Electrochemical deposition of nickel Electroplating-Cu - Electrochemical deposition of copper MOCVD - Epitaxial growth - Ask the department of photonics if you are interested: Elizaveta Semenova or Kresten Yvind