Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
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|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
! | ! | ||
! BHF | ! BHF (KOH) in D-3(Oxide etch 1: BHF) | ||
! BHF | ! BHF clean in D-3 (Oxide etch 2: BHF) | ||
! BHF in RCA Bench | ! BHF in RCA Bench | ||
! BHF in PP-bath | ! BHF in PP-bath | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Restrictions | !Restrictions | ||
|Wafers have to be cleaned in 7UP or RCA before further processing. | |||
|No wafers with metal are allowed in this bath | |No wafers with metal are allowed in this bath | ||
|Only for wafers with phosphor glass or boron glass that comes directly from one of the furnaces in stack A. All other substrates and material are strictly forbidden to go into the tank. | |Only for wafers with phosphor glass or boron glass that comes directly from one of the furnaces in stack A. All other substrates and material are strictly forbidden to go into the tank. | ||
|None | |None | ||