Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
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'''The user manual, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=384 LabManager]''' | '''The user manual, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=384 LabManager]''' | ||
{| border="2" cellspacing="0" cellpadding="2" | |||
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | |||
|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific Process Knowledge/Lithography/LiftOff#Lift-off |Lift-off]]</b> | |||
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!style="background:silver; color:black;" align="center"|Purpose | |||
|style="background:LightGrey; color:black"| | |||
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* AZ 5214E lift-off | |||
* AZ nLOF lift-off | |||
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!style="background:silver; color:black;" align="center"|Bath chemical | |||
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NMP (Remover 1165) / Rinse in IPA | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters | |||
|style="background:LightGrey; color:black"|Process temperature | |||
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Heating of the bath is possible. | |||
The heating has been limited to 60°C | |||
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|style="background:LightGrey; color:black"|Ultrasonic agitation | |||
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Continuous or pulsed | |||
The power may be varied | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Substrate size | |||
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* 100 mm wafers | |||
* 150 mm wafers | |||
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| style="background:LightGrey; color:black"|Allowed materials | |||
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Silicon or glass wafers | |||
Film or patterning of all but Type IV (Pb, Te) | |||
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|style="background:LightGrey; color:black"|Batch | |||
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1 - 25 | |||
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== Process information == | == Process information == | ||