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Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions

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Mbec (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
186 edits
Mbec (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
186 edits
Line 156: Line 156:
|-style="background:silver; color:black"
|-style="background:silver; color:black"
!  
!  
! BHF clean in Cleanroom3
! BHF clean in D-3
! BHF in Cleanroom3 (KOH bench 1+2)
! BHF in D-3 (Oxide etch 1: BHF)
! BHF in Cleanroom4 (KOH bench 6”)
! BHF in RCA Bench
! BHF in RCA Bench
! BHF in PP-bath
! BHF in PP-bath
Line 176: Line 175:
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Size of substrate
!Size of substrate
|2"-4" wafers
|2"-6" wafers
|2"-4" wafers
|2"-6" wafers
|2"-6" wafers
|2"-6" wafers
|2"-6" wafers
|2"-6" wafers
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