Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions
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*[[Specific Process Knowledge/Thin film deposition/Deposition of Silver|Silver (Ag)]] | *[[Specific Process Knowledge/Thin film deposition/Deposition of Silver|Silver (Ag)]] | ||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon|Silicon (Si)]] | *[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon|Silicon (Si)]] | ||
*[[Specific Process Knowledge/Thin film deposition/Deposition of NiV/Sputtering of NiV in Lesker|NiV alloy]] | |||
*Iron (Fe) | *Iron (Fe) | ||
*+ many more ([[#List of available targets for the Sputter-System(Lesker) (03 June 2013)|see list below]] or ask) | *+ many more ([[#List of available targets for the Sputter-System(Lesker) (03 June 2013)|see list below]] or ask) | ||
Contact the pvd-group if you have special needs (pvd@danchip.dtu.dk). | Contact the pvd-group if you have special needs (pvd@danchip.dtu.dk). | ||
====Sputter rate==== | ====Sputter rate==== | ||
The sputter rate depends on | The sputter rate depends on | ||