Specific Process Knowledge/Thin film deposition/ALD2 (PEALD): Difference between revisions
| Line 107: | Line 107: | ||
|style="background:LightGrey; color:black"|Batch size | |style="background:LightGrey; color:black"|Batch size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *Small samples and single wafers are loaded through the load lock | ||
*100 mm and smaller are loaded on a carrier plate (150 mm) | *100 mm and smaller are loaded on a carrier plate (150 mm) | ||
*150 mm or 200 mm wafer don't need the carrier plate | *150 mm or 200 mm wafer don't need the carrier plate | ||