Specific Process Knowledge/Thin film deposition/ALD2 (PEALD): Difference between revisions
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|style="background:LightGrey; color:black"|Deposition rates | |style="background:LightGrey; color:black"|Deposition rates | ||
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*Al<sub>2</sub>O<sub>3</sub>: ~ 0.075 - 0.097 nm/cycle (Using the "Al2O3" recipe, depending on the temperature) | *Al<sub>2</sub>O<sub>3</sub>: ~ 0.075 - 0.097 nm/cycle (Using the "Al2O3" recipe, depending on the temperature). Result from ALD1 | ||
*TiO<sub>2</sub>: 0.041 - 0.061 nm/cycle (Using the "TiO2" recipe, depending on the temperature) | *TiO<sub>2</sub>: 0.041 - 0.061 nm/cycle (Using the "TiO2" recipe, depending on the temperature). Result from ALD1 | ||
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|style="background:LightGrey; color:black"|Thickness | |style="background:LightGrey; color:black"|Thickness | ||
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*Al<sub>2</sub>O<sub>3</sub>: 0 - 100 nm | *Al<sub>2</sub>O<sub>3</sub>: 0 - 100 nm | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan=" | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter | ||
|style="background:LightGrey; color:black"|Temperature | |style="background:LightGrey; color:black"|Temperature | ||
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|style="background:LightGrey; color:black"|Precursors | |style="background:LightGrey; color:black"|Precursors | ||
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*TMA | *TMA - Trimethylaluminium | ||
*TiCl<sub>4</sub> | *TiCl<sub>4</sub> - Titaniumtetrachloride | ||
*H<sub>2</sub>O | *H<sub>2</sub>O - Water | ||
*O<sub>3</sub> | *O<sub>3</sub> - Ozone | ||
*NH<sub>3</sub> - Ammonia | |||
*SAM24 - Bis(diethylamono)silane | |||
*TEMAHf - Tetrakis(ethylmethylamino)hafnium | |||
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|style="background:LightGrey; color:black"|Plasma precursors | |||
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*N<sub>2</sub> | |||
*O<sub>2</sub> | *O<sub>2</sub> | ||
*NH<sub>3</sub> | |||
*(4% H<sub>2</sub> in N<sub>2</sub>) will be installed later | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Batch size | |style="background:LightGrey; color:black"|Batch size | ||
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* | *Samll samples and single wafers are loaded through the load lock | ||
*100 mm and smaller are loaded on a carrier plate (150 mm) | *100 mm and smaller are loaded on a carrier plate (150 mm) | ||
*150 mm or 200 mm wafer don't need the carrier plate | *150 mm or 200 mm wafer don't need the carrier plate | ||