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Specific Process Knowledge/Thin film deposition/Sputter coater: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Pevo (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
2,366 edits
Line 152: Line 152:
*Not measured
*Not measured
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|style="background:LightGrey; color:black"|Process pressure
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range
|style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Pressure||style="background:WhiteSmoke; color:black"|
*0.01 mbar
*0.01 mbar
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!style="background:silver; color:black;" align="left"|Purpose
|style="background:LightGrey; color:black"|Sputter time
|style="background:LightGrey; color:black"| ||style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Gold sputter coating of different samples before SEM characterization
*Maximum 30 s
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!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
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