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Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions

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|style="background:WhiteSmoke; color:black"|'''Max Ramp up and down (W/s)'''
|style="background:WhiteSmoke; color:black"|'''Max Ramp up and down (W/s)'''
|-
|-
|Ag||    0,250"|| 99,9% || 471 || 10
|Ag||    0,250"|| 99,9% || 314 || 20
|-
|-
||Al|| 0,250"|| 99,99%
||Al|| 0,250"|| 99,99% || 314 || 20
|-
|-
|Au||   0,125"|| 99,999%
|Au||   0,125"|| 99,999% || 314 || 20
|-
|-
|Co|| 0,0625"|| 99,95%
|Co|| 0,0625"|| 99,95% || 126 || 10
|-
|-
|Cr||   0,125"|| 99,95%
|Cr||   0,125"|| 99,95% || 251 || 20
|-
|-
|Cu|| 0,250"|| 99,99%
|Cu|| 0,250"|| 99,99% || 314 || 20
|-
|-
|Fe|| 0,0625"|| 99,9%
|Fe|| 0,0625"|| 99,9% || 126 || 10
|-
|-
|Ge|| 0,250"|| 99,999%
|Ge|| 0,250"|| 99,999% || 126 || 0.5
|-
|-
|Mg|| 0.250"|| 99,95%
|Mg|| 0.250"|| 99,95% || 215 || 20
|-
|-
|Mo|| 0,250"|| 99,95%
|Mo|| 0,250"|| 99,95% || 314 || 20
|-
|-
|Nb|| 0,250"|| 99,95%
|Nb|| 0,250"|| 99,95% || 314 || 20
|-
|-
|Ni||   0,125"|| 99,9%
|Ni||   0,125"|| 99,9% || 188 || 10
|-
|-
|Pd|| 0,125"|| 99,95%
|Pd|| 0,125"|| 99,95% || 251 || 20
|-
|-
|Pt||   0,125"|| 99,95%
|Pt||   0,125"|| 99,95% || 251 || 20
|-
|-
|Ru||   0,125"|| 99,95%
|Ru||   0,125"|| 99,95% || 314 || 20
|-
|-
|Si, Undoped|| 0,250"|| 99,999%
|Si, Undoped|| 0,250"|| 99,999% || 126 || 0.5
|-
|-
|Ta||   0,250"|| 99,95%
|Ta||   0,250"|| 99,95% || 314 || 20
|-
|-
|Te||   0,250"|| 99,999%
|Te||   0,250"|| 99,999% || 16 || 0.5
|-
|-
|Ti|| 0,250"|| 99,7%
|Ti|| 0,250"|| 99,7% || 251 || 20
|-
|-
|Al2O3|| 0,125" + Cu backing plate|| 99,99%
|Al2O3|| 0,125" + Cu backing plate|| 99,99% || 63 || 0.5
|-
|-
|Al2O3|| 0,250"|| 99,99%
|Al2O3|| 0,250"|| 99,99% || 63 || 0.5
|-
|-
|Al/Cu99,5/0,5%||   0,250"|| 99,99%
|Al/Cu99,5/0,5%||   0,250"|| 99,99% || 314 || 20
|-
|-
|Co/Fe  50/50%||   0,0625"|| 99,95%
|Co/Fe  50/50%||   0,0625"|| 99,95% || 126 || 10
|-
|-
|Co/Fe  80/20%||   0,0625"|| 99,95%
|Co/Fe  80/20%||   0,0625"|| 99,95% || 126 || 10
|-
|-
|Co/Fe  90/10%||   0,0625"|| 99,95%
|Co/Fe  90/10%||   0,0625"|| 99,95% || 126 || 10
|-
|-
|Cr2O3||   0,125" + Cu backing plate|| 99,8%
|Cr2O3||   0,125" + Cu backing plate|| 99,8% || 63 || 0.5
|-
|-
|Cu/Ti/25%|| 0,125"|| 99,99%
|Cu/Ti/25%|| 0,125"|| 99,99% || 251 || 20
|-
|-
|Fe/Mn  50/50%|| 0,250"|| 99,95%
|Fe/Mn  50/50%|| 0,250"|| 99,95% || 126 || 10
|-
|-
|ITO (In2O3/SnO2)  90/10%||  0,125"|| 99,99%
|ITO (In2O3/SnO2)  90/10%||  0,125"|| 99,99% || 63 || 0.5
|-
|-
|Mn/Ir80/20%|| 0,125"|| 99,9%
|Mn/Ir80/20%|| 0,125"|| 99,9% || 251 || 20
|-
|-
|MgO||  0,125"|| 99,95%
|MgO||  0,125"|| 99,95%
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Lesker"