Jump to content

Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions

Jmli (talk | contribs)
Jmli (talk | contribs)
Line 12: Line 12:


The DRIE Pegasus is a state-of-art silicon dry etcher that offers outstanding performance in terms of etch rate, uniformity etc. It uses the so-called Bosch process to achieve excellent control of the etched features. Click [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/System-description|HERE]] for more fundamental information of the system.
The DRIE Pegasus is a state-of-art silicon dry etcher that offers outstanding performance in terms of etch rate, uniformity etc. It uses the so-called Bosch process to achieve excellent control of the etched features. Click [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/System-description|HERE]] for more fundamental information of the system.
=== Change of showerhead in December 2014 ===
The showerhead that distributes the process gasses inside the plasma source has been changed. With the new design the gas flow resistance in the gas line from MFC to plasma has been reduced. This has very little or no impact on processes that have a continuous gas flow - i.e. processes that are not switched. However, for processes with several gas flows that switch on and off, the switching from one gas flow to another will be much more well defined. This enables us to run Bosch processes with shorter cycles times. Shorter cycles times means smaller scallops and hence lower roughness and better control.
As stated, we believe that only switched processes will be affected by this change. Continuous processes such as [[Specific Process Knowledge/Etch/DRIE-Pegasus/processC|Process C]], [[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano142|Nano1.42]], isotropic etches, barc etches or the black silicon recipes are not believed to be noticeably affected.
Click [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange|HERE]] to see a comparison of some the etches before and after the change of the showerhead.


'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''