Specific Process Knowledge/Pattern Design: Difference between revisions
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=== Layout file format=== | === Layout file format=== | ||
For E-beam lithography the layout file has to be saved as a GDS file that is uploaded to the equipment computer. | For '''E-beam lithography''' the layout file has to be saved as a GDS file that is uploaded to the equipment computer. | ||
For laser cutting the layout file has to be saved as a DXF file that is uploaded to the equipment computer. For more details see [[Specific_Process_Knowledge/Back-end_processing/Mask_making|Mask Making on the Laser Micro Machining Tool]]. | For '''laser cutting''' the layout file has to be saved as a DXF file that is uploaded to the equipment computer. For more details see [[Specific_Process_Knowledge/Back-end_processing/Mask_making|Mask Making on the Laser Micro Machining Tool]]. | ||
For UV-lithography | For '''UV-lithography''' it is necescary to have a physical masks produced based on the layout file. The file format has to be CIF or GDS. | ||
For '''DUV-lithography''' and DUV-lithography it is necescary to have a physical masks produced based on the layout file. The file format has to be GDS. | |||
=== Tips and tricks for mask designing === | === Tips and tricks for mask designing === | ||