Specific Process Knowledge/Thermal Process/Dope with Phosphorus: Difference between revisions
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==Test of the Phosphorus Predep furnace== | ==Test of the Phosphorus Predep furnace== | ||
''' | |||
====Purpose==== | |||
''' | |||
To find the result of a specific process using the Phosphorus Predep furnace (A4) followed by a drive in and oxidating the substrate in the Phosphorous drive in furnace (A3). | |||
''' | |||
====Experimental setup==== | |||
''' | |||
'''Substrate:''' p-type Si(100,) | '''Substrate:''' p-type Si(100,) | ||
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"Result from GreenBelt, @Danchip,Jan 2015" | "Result from GreenBelt, @Danchip,Jan 2015" | ||
==== | ==Test of the Phosphorus Predep furnace== | ||
''' | |||
====Purpose==== | |||
''' | |||
To find the doping profile after a specific process flow. The test was made by only performing the high-temperature process step after the pre-deposition step done in the Phosphorus Predep furnace (A4). The subsequently high temperature processes was done by using the Phosphorous drive in furnace (A3) and the Oxide Anneal Furnace (C3). | |||
''' | |||
====Experimental setup==== | |||
''' | |||
'''Substrate:''' p-type Si(100,) | '''Substrate:''' p-type Si(100,) | ||
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'''Resistivity:''' 1-20 Ωcm | '''Resistivity:''' 1-20 Ωcm | ||
The total thermal budget for the wafers: | '''The total thermal budget for the wafers:''' | ||
'''Predeposition in Furnace (A4):''' POCL1000, 15 min, no further anneal | '''Predeposition in Furnace (A4):''' POCL1000, 15 min, no further anneal | ||