Specific Process Knowledge/Thin film deposition: Difference between revisions

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[[/Deposition of Titanium Oxide|Titania (TiO<sub>2</sub>, Titanium Oxide)]]<br/>
[[/Deposition of Titanium Oxide|Titania (TiO<sub>2</sub>, Titanium Oxide)]]<br/>
[[/Deposition of Alumina|Alumina (Al<sub>2</sub>O<sub>3</sub>, Aluminium Oxide)]]<br/>
[[/Deposition of Alumina|Alumina (Al<sub>2</sub>O<sub>3</sub>, Aluminium Oxide)]]<br/>
[[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
[[Specific Process Knowledge/Thin film deposition/Deposition of AlxNy|Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]] <br/>
[[Specific Process Knowledge/Thin film deposition/Deposition of AlxNy|Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]] <br/>
[[/Lesker|Tantalum (Ta<sub>2</sub>O<sub>5</sub>, Tantalum pentoxide)]]<br/>
[[/Lesker|Tantalum (Ta<sub>2</sub>O<sub>5</sub>, Tantalum pentoxide)]]<br/>

Revision as of 10:09, 7 October 2015

3rd Level - Material/Method

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Choose material to deposit

Dielectrica Semicondutors Metals Alloys Transparent conductive oxides Polymers

Silicon Nitride - and oxynitride
Silicon Oxide
Titania (TiO2, Titanium Oxide)
Alumina (Al2O3, Aluminium Oxide)
Aluminum Nitride (AlxNy)
Aluminum Nitride (AlxNy)
Tantalum (Ta2O5, Tantalum pentoxide)
Cromia (Cr2O3, Chromium Oxide)

Silicon
Germanium
Zinc Oxide (ZnO)

Aluminium
Titanium
Chromium
Cobalt
Nickel
Copper
Molybdenum
Palladium
Silver
Tin
Tantalum
Tungsten
Platinum
Gold
Iron
Magnesium
Niobium
Ruthenium

TiW alloy (10%/90% by weight)
NiCr alloy
AlTi alloy
NiV alloy
MgB
AlCu
CoFe
CuTi
FeMn
MnIr
NiCo
NiFe
YSZ (Yttrium stabilized Zirconium)

ITO (Tin doped Indium Oxide)
AZO (Aluminum doped Zinc Oxide

SU8
Antistiction coating
Topas
PMMA

Choose deposition equipment

PVD LPCVD PECVD ALD Coaters Others


See the Lithography/Coaters page for coating polymers