Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing: Difference between revisions
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==Edge bead removal== | ==Edge bead removal== | ||
The automatic dispense system may also be used to administer solvent at the edge of the wafer after spin coating in order to remove the edge bead. Edge bead removal, or EBR, is usually done using PGMEA. Due to the low viscosity of the solvent, and the high pressure of the | |||
Observed dispense rates of PGMEA (uncertainty from measurements ~0.1 ml/s) for different tip sizes: | Observed dispense rates of PGMEA (uncertainty from measurements ~0.1 ml/s) for different tip sizes: | ||
*'''Red (0.010"):''' | *'''Red (0.010"):''' | ||