Specific Process Knowledge/Lithography/Development: Difference between revisions

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 '''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual click here]'''
-Developer: TMAH Manual is a manually operated, single substrate spray-puddle developer. It uses the TMAH based AZ 726 MIF developer (2.38 % TMAH in  water with a small amount of wetting agent). The substrates are loaded manually one by one into the developer. Developer dispense, puddle time, and a rough water rinse is performed automatically by the equipment.
+Developer: TMAH Manual is a manually operated, single substrate or chip spray-puddle developer. It uses the TMAH based AZ 726 MIF developer (2.38 % TMAH in  water with a small amount of wetting agent). The substrates or chips are loaded manually one by one into the developer. Developer dispense, puddle time, water rinse, and drying is performed automatically by the equipment.
 '''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 LabManager]'''
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 ===Process information===
-'''Standard process recipes'''
+'''Process recipes'''
-*nLoF_40x2: double puddle, 40s each. For development of AZ nLOF 2020 resist.
+*SP 60s: Single puddle, 60s. Rinse and dry.
-*MiR701 60s: single puddle, 60s. For development of AZ MiR 701 resist.
+*SP 60s agi: Single puddle, 60s. 15 cycles per minute agitation during development. Rinse and dry.
-*DUV 60s: single puddle, 60s. For development of DUV resists.
+*SP 60s prw: Single puddle, 60s. Pre-wetting step during developer dispense. Rinse and dry.
 '''Utility recipes'''
 *UTIL-DR: Dome rinse.