Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing: Difference between revisions
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[[Image:RCD8 SU-8 2075.jpg|300x300px|thumb|right|Spin curve for SU-8 2075]] | [[Image:RCD8 SU-8 2075.jpg|300x300px|thumb|right|Spin curve for SU-8 2075]] | ||
[[Image:RCD8 SU-8 2075 Gyrset.jpg|300x300px|thumb|right|Spin curve for SU-8 2075 using Gyrset]] | [[Image:RCD8 SU-8 2075 Gyrset.jpg|300x300px|thumb|right|Spin curve for SU-8 2075 using Gyrset]] | ||
Spin coating of SU-8 2075 on Spin Coater: RCD8 using automatic dispense consists of three process steps: static dispense, spread, and spin-off. In the static dispense step the | Spin coating of SU-8 2075 on Spin Coater: RCD8 using automatic dispense consists of three process steps: static dispense, spread, and spin-off. In the static dispense step the media arm is moved to the center of the wafer, and resist is dispensed for ??s, yielding a volume of ??ml at 2.0 bar. After the dispense, the media arm is moved up and down in a series of steps designed to break the string of resist between the syringe and the wafer. In the spread step the wafer is accelerated to ??rpm at ??rpm/s, and spun for ??s. In the spin-off step the wafer is accelerated at ??rpm/s to the spin-off speed, spun for 30s, then decelerated at ??rpm/s. | ||
<br>In the Gyrset version, the Gyrset is closed after the dispense step, and opened after the spin-off step. | <br>In the Gyrset version, the Gyrset is closed after the dispense step, and opened after the spin-off step. | ||