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Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing: Difference between revisions

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''Recipe names, process parameters, and test results:''
''Recipe names, process parameters, and test results:''
*'''1 DCH 5214E man disp 1.5um'''
Spin-off: 30 s at 4700 rpm. '''OBS!''' ''Do not use with non-vacuum chuck!''
{|border="1" cellspacing="0" cellpadding="3" style="text-align:left;"
|-
|-style="background:silver; color:black"
!Substrate
!Thickness
!Uniformity (+/-)
!Test date
!Tester initials
!Comments
|-
|-style="background:WhiteSmoke; color:black"
|Silicon with native oxide
|1.52 µm
|0.3%
|21/4 2015
|taran
|9 points on one wafer, exclusion zone 5mm
|}


*'''1 DCH 5214E man disp 2.2um'''
*'''1 DCH 5214E man disp 2.2um'''